Weaker bonding can give larger thermal conductance at highly mismatched interfaces

Published in Science Advances, 2021

Recommended citation: Bin Xu, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, Junichiro Shiomi, "Weaker bonding can give larger thermal conductance at highly mismatched interfaces." Science Advances, 2021. https://advances.sciencemag.org/content/7/17/eabf8197